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Future of Thermal Management and Temperature Mitigation at Leading US Conference on Thermal Management

PRWeb Wednesday, 20 June 2018
Advancements in Thermal Management Conference is the leading educational and technical event in the US, covering the latest technologies for managing temperature in electronic devices.

NEW YORK (PRWEB) June 20, 2018

From supercomputers to cell phones, increased processing power is a must for devices to keep pace in the smart technology world. With ever-evolving power and processing requirements comes the need to keep electronics cool and operational. That is why the 10th Annual Advancements in Thermal Management Conference is coming to Denver, CO on August 8th and 9th. This unique event will feature technical presentations and focused exhibits on the latest technology for managing temperature in electronic devices.

Advancements in Thermal Management is the leading educational and technical conference in the US each year, specifically tailored for engineers, material scientists, researchers, CTOs, R&D managers and product developers looking for the latest technologies to mitigate temperature in their applications. If your products and services depend upon sophisticated and precise control of thermal properties and states, this is your must-attend event of the year. Learn more at http://www.thermalconference.com.

β€œThe need for more advanced thermal management technology has become a priority for everyone involved in the design of smart products,” said Nick Depperschmidt, conference chairman. β€œWe’ve brought together some of the best engineering minds in the industry to discuss the latest thermal management technology and solutions. We will be looking at thermal materials such as SIC/Diamond, Aerogels, ceramics, h-BN, as well as specific applications such as: OLEDs, automotive/HEVs, vapor chambers, acoustic micro imaging, IC modeling, drones, CFD, printers and batteries.”

Confirmed speakers for the event include experts from: Fujitsu Labs, Lawrence Livermore National Labs, Intel, W.L. Gore & Associates, University of San Jose, Mentor Graphics, University of Colorado, Software Cradle, MacDemid Performance Solutions, Momentive Performance Materials, Nordson Sonoscan and many more.

Current Exhibiting companies include: Software Cradle (MSC Software,) KULR Technology, Ventec International, Nordson Sonoscan, GORE, COFAN USA, LiSAT, TA Instruments and Electronic Cooling Solutions.

This conference is a once a year opportunity to learn from and network with these industry leaders during two days of technical sessions. Visit http://www.thermalconference.com for more information.
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